Customization: | Available |
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Metal Coating: | Gold |
Mode of Production: | SMT |
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Common Technical Parameters for LED PCBA | |
Attribute | Typical Parameter Range |
Board Thickness | - Standard Thickness: 0.8mm~3.0mm (FR4) - Aluminum Substrate: 1.0mm~3.0mm |
Copper Thickness | - Outer Layer: 1oz~2oz (35μm~70μm) - Inner Layer: 0.5oz~1oz (17μm~35μm) |
Minimum Hole Size | - Mechanical Drilling: ≥0.2mm~0.3mm - Laser Drilling: ≥0.1mm |
Min. Line Width/Spacing | - Standard Design: ≥0.1mm/0.1mm - High-Density Design: ≥0.075mm/0.075mm |
Surface Finish | - HASL (Hot Air Solder Leveling): Low cost for general use - ENIG (Electroless Nickel Immersion Gold): Flat surface for SMT - OSP (Organic Solderability Preservatives): Eco-friendly but shorter shelf life - Silver Plating: For high-frequency/high-thermal applications |
Board Specifications | - Dimensions: ≤500mm×600mm (standard production size) - Layers: 1~6 layers |
Material | - Aluminum Substrate: Thermal conductivity 1.0~3.0W/(m·K) - FR4: Tg value 130℃~180℃ - Flexible Board: Polyimide (PI) |
Substrate Type | - Rigid: FR4 (glass fiber epoxy resin) - Metal Core: Aluminum (e.g., 5052 alloy) - Flexible: PI/PET |
LED PCBA Manufacturing Capabilities | |
PCBA | PCB+components sourcing+assembly+package |
Assembly Details | SMT and Thru-hole, ISO SMT and DIP lines |
Lead Time | Prototype : 15 work days. Mass order : 20~25 work days |
Testing on products | Testing jig/mold , X-ray Inspection, AOI Test, Functional test |
Quantity | Min quantity : 1pcs. Prototype, small order, mass order, all OK |
Files needed | PCB : Gerber files(CAM, PCB, PCBDOC) Components : Bill of Materials(BOM list) Assembly : Pick-N-Place file |
PCB Panel Size | Min size : 0.25*0.25 inches(6*6mm) Max size : 1200*600mm |
Components Details | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Component Package | Cut Tape, Tube, Reels, Loose Parts |
PCB+ Assembly Process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |